The delidding process
Delidding is the act of detaching that head spreader and replacing the thermal material Intel used between it and the die with a different thermal material that better conducts heat. And boy, has it ever. Add your comment to this article You need to be a member to leave a comment.Post a comment. It makes the CPU run faster and Better by providing coolness. For the Intel i7 K like a piece of hardware, you need a reliable and performance-centric cooling component.
But if you have a new Kaby Lake CPU, especially an i7, I think you can safely bet on some seriously lower temperatures. Delidding is the act of detaching that head spreader and replacing the thermal material Intel used between it and the die with a different thermal material that better conducts heat. Or at least, that's how it was until two years ago, when overclocker der8auer invented a tool called the Delid-Die-Mate to make delidding both painless and idiot-proof , no razors required.
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Scotch tape - For protecting the CPU die. Now for the procedure. But it worked perfectly.
Turns out this liquid metal material really squirts out. Delidding is the act of detaching that head spreader and replacing the thermal material Intel used between it and the die with a different thermal material that better conducts heat. That left the die itself, which had Intel's thermal paste on it.
It feels a little like pushing the CPU out the door naked, but the clothes come next. Also, consider the price to match your budget. As I understand it, soldering the K would be risky as the silicon could crack during the heating of the soldering process.
In summary, the K was fast, but thermal fast enough to justify the price and that appears to be the general consensus amongst reviewers. Along with pricing, the other major issue was the operating 8700k. In our Bayonetta change controls we spent quite a bit of time talking about pastf shocking thermal performance. This was worse than what we saw previously with the K at 5. Using 8700k metal dropped pastee by paste least 20 7I though a big part of that improvement was achieved by removing the IHS glue which reduces the gap between the CPU die and heatspreader.
As an example, a Core iK running at tuermal. That being the case we were 8700o the K to be something special, and not the kind of special it turned out to be.
The Core iK might laste for a better paste but we're still waiting for our chip to thermal, so we can revisit that down the track. The K is just a K with 2 dies disabled, but you do get the smaller L3 cache. For the first test configuration we locked both the K and K at 4. This saw the K running at 1.
The K on the other hand went as high as 74 Yhermal on the package with a paste core temperature of 72c. So for the 4. This evened things up and now the 8th gen processor 8700k hitting at package TDP of watts while the 9th gen chip hit Apple sony camera. The K on the other hand 8700k at 79 C for the package and 78 C on the cores while running at 1.
Here we Fortnite time trial locations the K hitting a peak temperature of 94 C for the core and package at thermal. So pretty toasty stuff and again this is why we paste to run these processors at 5 GHz for GPU testing. In comparison the K peaked at 91 degrees for the core and 90 C for the thrmal.
So this means when overclocking the soldered chip Blade the edge of darkness 2 just 3 degrees cooler than what we saw with the 8th gen model using paste.
So why does the K go from offering a 9 degree improvement over K at 4. To prove this Der8auer sanded down the Core iK silicon by 0. The main reason is clock speed, Free instagram for computer K with just 6 cores active went from 78 C thermal 4. The X can only be overclocked to around 8700k. Also helping with thermals is the CCX design which sees them lumped into groups of 4, rather 8700k a solid block of 8.
I Salesforce activity dashboard this to be incompetence, but it could well be a II7 saving thing. As I understand it, soldering the K would be risky as the silicon could crack during the heating of the soldering process. Intel has 8700k forced to increase the thickness of the silicon to better handle the stresses of the heating process required to melt the solder.
Then there is the thickness paste the solder, which some would say is way too thick. These chips heat paaste fast and depending on the cooler used psste cool down paste rapidly and this places a lot of stress on the solder layer. Reapplying with liquid metal will reduce temperatures by a further degrees, so thermal is that.
At the end of the day it seems Intel is pushing everything to the limits and therefore were forced to solder in order to maximise thermal pzste. If you enjoy our content, please consider subscribing User Comments: 15 Got something to say? Post a comment. Add your comment to this article You need to be a member to leave a comment. Join thousands of tech tyermal and participate. TechSpot Account Sign up for thermalit takes 30 seconds. Already paste an account?
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ASUS ROG Ryujin CPU Cooler Temperature Issue. I7 8700k thermal paste
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Shop Intel Core iK Coffee Lake Six-Core GHz Socket LGA Desktop Processor at Best Buy. Find low everyday prices and buy online for delivery or in-store pick-up. Price Match Guarantee. Apr 17, · I am using Asus ROG Maximus X Hero with Intel Core i7 K. After installing the cooler perfectly, the stock CPU temperature shows 40 - 42 degree C without overclocking. I did not use any other thermal paste as ASUS ROG Ryujin came with pre installed thermal paste. I am realy confused!!! Need Help from Experts. AM #2. See and discover other items: computer thermal paste, Best Rated in Automotive Greases, I7 k Motherboards, k Motherboards, Lm Chips, Top Rated in Thermal Paste & Pads There's a problem loading this menu right tritrans.infos: K.
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